孙 婷
职称与职务:副教授
专 业:化学
电 话:13558788037
E-Mail:tingsun17@outlook.com; 1433513400@qq.com
1997.09-2002.07大连理工大学学习,化学工程+英语双学士学位;2002.08-2004年 美国俄克拉何马大学(University of Oklahoma)化学系全额奖学金学习,分析化学硕士学位;2005.08-2009.05美国亚利桑那大学(University of Arizona)化学工程系环境友好半导体制造SEMATECH/SRC工程研究中心深造,化学工程博士学位;2009.05-2011.04美国Cabot Microelectronics Corp.工作,Research Scientist; 2011.07至今 四川师范大学工作,副教授,硕士研究生导师。
超疏水材料的制备及其在防除冰中的应用;CO2催化加氢制备高值化学品过程;纳米多相催化/光催化氧化降解有机物;化学机械磨平(Chemical Mechanical Planarization)过程研究等。
Book Chapter:
T. Sun, Z. Han, M. Keswani, Brush Scrubbing for Post-CMP Cleaning, Developments in Surface Contamination and Cleaning Vol 9, 11 November 2016, 109-133, Elsevier Inc.
Archived Journal Paper:
1. K. Chen and T. Sun, Effects of microstructure design on aluminum surface hydrophobic and ice-retarding properties, ASIA-PACIFIC JOURNAL OF CHEMICAL ENGINEERING, 2017, DOI: 10.1002/apj.2073
2. Kai Chen, Ting Sun and Hai Xiang, Removal of Linear and Monobranched Alkane from Aviation Gasoline by 5A Zeolite Adsorption for Octane Number Enhancement, THE CANADIAN JOURNAL OF CHEMICAL ENGINEERING, 94:128–133, 2016
3. K. Chen, T. Sun and H. Xiang, Effects of TRiEGME on water icing behavior in aviation turbine fuel, ASIA-PACIFIC JOURNAL OF CHEMICAL ENGINEERING, 2016, 11:118-123
4. T. Sun, K. Chen, Removal of Isopropyl Alcohol (IPA) in UPW by Synergistic Photocatalytic Oxidation and Adsorption, THE CANADIAN JOURNAL OF CHEMICAL ENGINEERING, 92:1174–1180, 2014
5. T. Sun, K. Chen, Removal of Isopropyl Alcohol (IPA) in UPW by Synergistic Photocatalytic Oxidation and Adsorption, THE CANADIAN JOURNAL OF CHEMICAL ENGINEERING, 92:1174–1180, 2014
6. K. Chen, T. Sun, Nonuniformity behavior during regeneration of the diesel particulate filter, ASIA-PACIFIC JOURNAL OF CHEMICAL ENGINEERING, 2013; 8:922-930
7. T. Sun, K. Chen, A novel low-energy hybrid process for the removal of organic contaminants in ultrapure water systems, ASIA-PACIFIC JOURNAL OF CHEMICAL ENGINEERING, 8: 804–810, 2013
8. T. Sun, Y. Zhuang, W. Li, A. Philipossian, Investigation of eccentric PVA brush behaviors in post-Cu CMP cleaning, Microelectronic Engineering, 100, 20-24, 2012
9. T. Sun, L. Borucki, Y. Zhuang, A. Philipossian, “Characterization of Pad-Wafer Contact and Surface Topography in Chemical Mechanical Planarization Using Laser Confocal Microscopy”, Japanese Journal of Applied Physics, 49, 066501 , 2010
10. T. Sun, L. Borucki, Y. Zhuang, A. Philipossian, “Optical and Mechanical Characterization of Chemical and Mechanical Planarization Pad Surfaces”, Japanese Journal of Applied Physics, 49, 046501, 2010
11. T. Sun, L. Borucki, Y. Zhuang, R. Dittler, Y. Sampurno, F. Sudargho, X. Wei, S. Anjur, A. Philipossian, “Investigating the Effect of Conditioner Aggressiveness on Removal Rate during ILD CMP through Confocal Microscopy and Dual Emission UV Enhanced Fluorescence”, Japanese Journal of Applied Physics, 49, 026501, 2010
12. T. Sun, L. Borucki, Y. Zhuang, A. Philipossian, “Investigating the Effect of Diamond Size and Conditioning Force on Chemical Mechanical Planarization Pad Topography”, Microelectronic Engineering, 87(4), 553, 2010
13. A. Philipossian, and T. Sun, “Frictional Analysis of Various PVA Brush Roller Designs for Post-ILD CMP Scrubbing Applications”, Electrochemical and Solid-State Letters, 12(3), H484, 2009
14. L. Borucki, T. Sun, Y. Zhuang, D. Slutz and A. Philipossian, “Pad Topography, Contact Area and Hydrodynamic Lubrication in Chemical-Mechanical Polishing”, Materials Research Society Symposium Proceedings, 1157, E01, 2009
15. T. Sun and A. Philipossian, “Method for Determining the Lubrication Mechanism of Post- ILD CMP Brush Scrubbing”, Electrochemical and Solid-State Letters, 11(8), H214, 2008
16. T. Sun, L. Borucki, Y. Zhuang, A. Philipossian, “Investigation of diamond grit size and conditioning force effect on CMP pads topography”, Materials Research Society Symposium Proceedings, 991, 45-49, 2007
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